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| Model |
JL-D16 |
| General Capacity |
|
| Diameter of lapping plate |
1127 mm |
| Diameter of carrier(planetary carrier) |
Ø370mm
DP12, Z200 |
| Quantity of carrier(planetary carrier) |
5 SETS |
| Total processed quantity |
6”Wafer: 15 pcs
8” Wafer: 5 pcs
12” Wafer: 5 pcs |
| Max. lappin,g thickness |
40 mm |
| Min. lapping thickness |
0.4 mm |
| Automatic thickness control |
Optional |
| Controller |
|
| Pressing method |
Air cylinder pressing |
| Pressure control |
Electronic proportional |
| Touchscreen |
PLC + Touchscreen |
| Internal gear disc |
3 HP |
| Upper plate drive horsepower |
5 HP |
| Lower plate drive horsepower |
15 HP |
| Lapping plate speed |
20~60 R.P.M. |
| Pressure on lapping plate |
10 ~ 300 KG |
| Machine Dimension and Weight |
|
| Machine dimensions |
W: 2300 x D:1420 x H:2550 mm |
| Machine net weight |
6200 KGS |
| Machine net weight |
6680 KGS |
| Power source |
3Ø 220V (3Ø 380V) |
