Model | JL-D16 |
---|---|
General Capacity | |
Diameter of lapping plate | 1127 mm |
Diameter of carrier(planetary carrier) | Ø370mm DP12, Z200 |
Quantity of carrier(planetary carrier) | 5 SETS |
Total processed quantity | 6”Wafer: 15 pcs 8” Wafer: 5 pcs 12” Wafer: 5 pcs |
Max. lappin,g thickness | 40 mm |
Min. lapping thickness | 0.4 mm |
Automatic thickness control | Optional |
Controller | |
Pressing method | Air cylinder pressing |
Pressure control | Electronic proportional |
Touchscreen | PLC + Touchscreen |
Internal gear disc | 3 HP |
Upper plate drive horsepower | 5 HP |
Lower plate drive horsepower | 15 HP |
Lapping plate speed | 20~60 R.P.M. |
Pressure on lapping plate | 10 ~ 300 KG |
Machine Dimension and Weight | |
Machine dimensions | W: 2300 x D:1420 x H:2550 mm |
Machine net weight | 6200 KGS |
Machine net weight | 6680 KGS |
Power source | 3Ø 220V (3Ø 380V) |