Product Name : JL-200SCG/300SCGII
Product Description
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Wafer Grinding Machine

*JL-200SCG/300SCGII
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  • 300SCGII
  • JL-200SCG
Model 300SCGII JL-200SCG
Working table diameter ɸ300 ɸ200
Machine equipment One spindle/ on rotary table One spindle/ on rotary table
Spindle    
from Air floating spindle Air floating spindle
Number of spindles(mm) 1 1
Servo motor power 15 3.7 kw
tool ɸ350 (mm) diamond grinding wheel ɸ250 (mm) diamond grinding wheel
Speed(rpm) Min1000 ~ Max 3000 rpm Min1000 ~ Max 3000 rpm
Z axis    
Stroke 200 100 mm
Feed resolution 0.1μm 0.1μm
max. rapid movement speed 300 mm / min 300 mm / min
Table    
Stroke Air floating spindle Air floating spindle
Number of table 1 1
Max. speed 500 rpm 500 rpm
Table size(mm) ɸ300 mm ɸ200 mm
Max. tableload 20 kg 15 kg
Size    
Machine net weight(Kgs) 3000kgs 2000 kg
Machine floor space(LxWxH) 1000 (W)×1700 (D)×2100 (H) mm 1000 (W)×1700 (D)×2100 (H) mm
Machining accuracy    
TTV
Surface roughness
1.5 μm/Ra
0.02μm(FOR wafer)
1.5 μmRa
0.02μm(FOR wafer)

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