JL-200SCG/300SCGII
可將下方點選取消後留下自己需求的規格
To leave the specifications below, please cancel the selection.
- 300SCGII
- JL-200SCG
Model | 300SCGII | JL-200SCG |
---|---|---|
Working table diameter | ɸ300 | ɸ200 |
Machine equipment | One spindle/ on rotary table | One spindle/ on rotary table |
Spindle | ||
from | Air floating spindle | Air floating spindle |
Number of spindles(mm) | 1 | 1 |
Servo motor power | 15 | 3.7 kw |
tool | ɸ350 (mm) diamond grinding wheel | ɸ250 (mm) diamond grinding wheel |
Speed(rpm) | Min1000 ~ Max 3000 rpm | Min1000 ~ Max 3000 rpm |
Z axis | ||
Stroke | 200 | 100 mm |
Feed resolution | 0.1μm | 0.1μm |
max. rapid movement speed | 300 mm / min | 300 mm / min |
Table | ||
Stroke | Air floating spindle | Air floating spindle |
Number of table | 1 | 1 |
Max. speed | 500 rpm | 500 rpm |
Table size(mm) | ɸ300 mm | ɸ200 mm |
Max. tableload | 20 kg | 15 kg |
Size | ||
Machine net weight(Kgs) | 3000kgs | 2000 kg |
Machine floor space(LxWxH) | 1000 (W)×1700 (D)×2100 (H) mm | 1000 (W)×1700 (D)×2100 (H) mm |
Machining accuracy | ||
TTV Surface roughness |
1.5 μm/Ra 0.02μm(FOR wafer) |
1.5 μmRa 0.02μm(FOR wafer) |