Product Name : JL-200SCG/JL-300SCG
Product Description

Rotary table series & Carriage(Wafer Grinding Machine)

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  • JL-200SCG
  • JL-300SCG
Model JL-200SCG JL-300SCG
Working table diameter ɸ200 ψ300
Machine equipment One spindle/ on rotary table One spindle/ on rotary table
from Air floating spindle Air floating spindle
Number of spindles(mm) 1 1
Servo motor power 3.7 kw 15
Speed(rpm) Min1000 ~ Max 3000 rpm Min1000 ~ Max 3000 rpm
tool ψ250(mm) ψ350(mm) diamond grinding wheel
Z axis    
Z axis -Stroke 100 mm 200
Feed resolution 0.1μm 0.1μm
max. rapid movement speed 300 mm / min 300 mm / min
Table-Stroke Air floating spindle Air floating spindle
Number of table 1 1
Max. speed 500 rpm 500 rpm
Table size(mm) φ200 mm φ300 mm
Max. tableload 15 kg 20 kg
Machine net weight(Kgs) 2000 kg 3000kgs
Machine floor space(LxWxH) 1000(W)×1700(D)×2100(H) mm 1000(W)×1700(D)×2100(H) mm
Machining accuracy    
Surface roughness
1.5 μmRa
0.02μm(FOR wafer)
1.5 μm/Ra
0.02μm(FOR wafer)