JL-200SCG/300SCGII
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- JL-200SCG
- 300SCGII
Model | JL-200SCG | 300SCGII |
---|---|---|
Working table diameter | ɸ200 | ɸ300 |
Machine equipment | One spindle/ on rotary table | One spindle/ on rotary table |
Spindle | ||
from | Air floating spindle | Air floating spindle |
Number of spindles(mm) | 1 | 1 |
Servo motor power | 3.7 kw | 15 |
tool | ɸ250 (mm) diamond grinding wheel | ɸ350 (mm) diamond grinding wheel |
Speed(rpm) | Min1000 ~ Max 3000 rpm | Min1000 ~ Max 3000 rpm |
Z axis | ||
Stroke | 100 mm | 200 |
Feed resolution | 0.1μm | 0.1μm |
max. rapid movement speed | 300 mm / min | 300 mm / min |
Table | ||
Stroke | Air floating spindle | Air floating spindle |
Number of table | 1 | 1 |
Max. speed | 500 rpm | 500 rpm |
Table size(mm) | ɸ200 mm | ɸ300 mm |
Max. tableload | 15 kg | 20 kg |
Size | ||
Machine net weight(Kgs) | 2000 kg | 3000kgs |
Machine floor space(LxWxH) | 1000 (W)×1700 (D)×2100 (H) mm | 1000 (W)×1700 (D)×2100 (H) mm |
Machining accuracy | ||
TTV Surface roughness |
1.5 μmRa 0.02μm(FOR wafer) |
1.5 μm/Ra 0.02μm(FOR wafer) |